Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-06-01
1989-06-27
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156 731, 156655, 156901, 228110, 437209, H01L 2158, H01L 2160, B23K 106, B32B 3116
Patent
active
048426628
ABSTRACT:
Tape-automated-bonding (TAB) tape can be directly bonded (i.e., no "gold bumps" are needed) to aluminum bonding pads of integrated circuit devices, without contacting any other part of the integrated circuit device, by use of a process employing the herein disclosed parameters of ultrasonic energy, pressure, time, heat, and relative dimensions of the TAB tape.
REFERENCES:
patent: 4189825 (1980-02-01), Robillard et al.
patent: 4676864 (1987-06-01), Maeda et al.
ISHM'87 Proceedings, Single Point Tab (SPT), a Versatle Tool for Tab Bonding, Gary Silverberg.
Cochran William W.
Hewlett--Packard Company
Powell William A.
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