Process for bonding integrated circuit components

Details Process for bonding integrated circuit components Process for bonding integrated circuit components

1988-06-01

1989-06-27

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156 731, 156655, 156901, 228110, 437209, H01L 2158, H01L 2160, B23K 106, B32B 3116

Patent

active

048426628

ABSTRACT:
Tape-automated-bonding (TAB) tape can be directly bonded (i.e., no "gold bumps" are needed) to aluminum bonding pads of integrated circuit devices, without contacting any other part of the integrated circuit device, by use of a process employing the herein disclosed parameters of ultrasonic energy, pressure, time, heat, and relative dimensions of the TAB tape.

REFERENCES:
patent: 4189825 (1980-02-01), Robillard et al.
patent: 4676864 (1987-06-01), Maeda et al.
ISHM'87 Proceedings, Single Point Tab (SPT), a Versatle Tool for Tab Bonding, Gary Silverberg.

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