Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Patent
1995-07-07
1998-11-17
Graybill, David
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
438 88, 438118, 438125, 438456, 438466, 438611, 438654, 438656, 438661, H01L 2160, H01L 2148
Patent
active
058375627
ABSTRACT:
A process for manufacturing a vacuum enclosure for a semiconductor device formed on a substrate with leads extending peripherally. Assembly of the enclosure is compatible with known batch fabrication techniques and is carried out at pressures required for optimal device operation. In a first embodiment, an intrinsic silicon shell is sealed to the substrate via electrostatic or anodic bonding with the leads diffusing into the shell. In a second embodiment, a thin interface layer of silicon or polysilicon is deposited on the substrate prior to electrostatic bonding a glass shell thereon. In a third embodiment, tunnels are formed between a lower peripheral edge of the shell and the substrate, allowing leads to pass thereunder. The tunnels are sealed by a dielectric material applied over the enclosure.
REFERENCES:
patent: 3721584 (1973-03-01), Diem
patent: 4079508 (1978-03-01), Nunn
patent: 4266156 (1981-05-01), Kizaki
patent: 4366342 (1982-12-01), Breedlove
patent: 4516148 (1985-05-01), Barth
patent: 4574263 (1986-03-01), Liddiard
patent: 4574327 (1986-03-01), Wilner
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 5047369 (1991-09-01), Fleming et al.
patent: 5177595 (1993-01-01), Beatty
patent: 5233874 (1993-08-01), Putty et al.
patent: 5261157 (1993-11-01), Chang
patent: 5293511 (1994-03-01), Poradish et al.
patent: 5406108 (1995-04-01), Inada
patent: 5532187 (1996-07-01), Schreiber-Prillwitz et al.
K. Minami, "Cavity Pressure Control for Critical Damping of Packaged Micro Mechanical Devices", The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Sweden, pp. 240-243, Jun. 25, 1995.
Graybill David
The Charles Stark Draper Laboratory Inc.
LandOfFree
Process for bonding a shell to a substrate for packaging a semic does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for bonding a shell to a substrate for packaging a semic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for bonding a shell to a substrate for packaging a semic will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-883813