Process for automatically regenerating copper chloride etch solu

Details Process for automatically regenerating copper chloride etch solu Process for automatically regenerating copper chloride etch solu

1985-10-15

1987-09-29

Bashore, S. Leon

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156666, 156345, 134 10, C23F 146

Patent

active

046967176

ABSTRACT:
The invention concerns a process for automatically regenerating copper chloride etch solutions, wherein regeneration is effected by means of hydrogen peroxide and hydrochloric acid in a regeneration unit separated from the etch chamber. The addition of hydrogen peroxide is controlled by a redox electrode, while hydrochloric acid and water are added in computed quantities. Hydrogen peroxide and hydrochloric acid are converted in an oxidation reactor into hypochlorous acid and immediately afterwards are combined with the copper (I) chloride etch solution which contains at least the quantity of hydrochloric acid required for oxidizing the copper (I) ions. In the regeneration unit a salt basket with solid sodium chloride is arranged or adjacent to said unit a salt tank with an overflow to said regeneration unit is provided, both of which permit the sodium chloride concentration of the etch solution being kept constant. The invention also comprises a system for automatically regenerating copper chloride etch solutions.

REFERENCES:
patent: 3306792 (1967-02-01), Thurmel et al.
patent: 3880685 (1975-04-01), Rehm et al.
patent: 4388276 (1983-06-01), Konstantouros et al.

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