Process for attaching a lead frame to a heat sink using a glob-t

Details Process for attaching a lead frame to a heat sink using a glob-t Process for attaching a lead frame to a heat sink using a glob-t

1994-03-04

1995-07-18

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437219, 437220, H01L 2156, H01L 2158, H01L 21603

Patent

active

054341051

ABSTRACT:
A method is disclosed for packaging an integrated circuit having a heat spreader for cooling an integrated circuit die and glob-topping to both protect bonding wires and attach the heat spreader to a lead frame.

REFERENCES:
patent: 4189083 (1980-02-01), Johnson et al.
patent: 4214364 (1980-07-01), St. Louis et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4849856 (1989-07-01), Funari et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5091341 (1992-02-01), Asada et al.
patent: 5309322 (1994-05-01), Wagner et al.

Affiliated with

Also associated with

Rating

Process for attaching a lead frame to a heat sink using a glob-t does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for attaching a lead frame to a heat sink using a glob-t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for attaching a lead frame to a heat sink using a glob-t will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2418935