Process for arranging printed conductors on the surface of a sem

Details Process for arranging printed conductors on the surface of a sem Process for arranging printed conductors on the surface of a sem

1996-08-29

1999-03-30

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438666, 438926, 257773, H01L 21441

Patent

active

058888934

ABSTRACT:
In a process for arranging printed conductors on the surface of a semiconductor component, distances from the first forbidden zones are maintained. This is accomplished by converting the first forbidden zones to second forbidden zones by enlargement, where the zones are enlarged in the x and y directions by a different factor than in the a and b directions. Then paths are produced outside of or at the edge of the second forbidden zones for the arrangement of printed conductors.

REFERENCES:
patent: 5228951 (1993-07-01), Pradel
patent: 5494853 (1996-02-01), Lur
patent: 5654221 (1997-08-01), Cronin et al.
Ioannis G. Tollis; Wiring In Uniform Grids and Two-Colorable Maps; Integration; 1991; pp. 189-210.

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