Fishing – trapping – and vermin destroying
Patent
1993-08-26
1996-02-20
Hearn, Brian E.
Fishing, trapping, and vermin destroying
427597, 148DIG93, H01L 21268, C23C 1414
Patent
active
054928613
ABSTRACT:
In order to provide a process for applying structured layers of a functional structure of a semiconductor component, with which structured layers of a functional structure of a semiconductor component can be produced as simply as possible and with as little susceptibility as possible with respect to the quality of the semiconductor components, it is suggested that a material film be arranged above a surface region of a process substrate to be provided with the structured layer, that the material film be acted upon on its side remote from the process substrate by a focus of a laser beam located in a defined position corresponding to the structured layer to be produced and that with the laser beam in the region of the focus the material from the material film migrate to the surface region.
REFERENCES:
patent: T988007 (1979-11-01), Drew et al.
patent: 3560258 (1971-02-01), Brisbane
patent: 4714628 (1987-12-01), Eloy
patent: 4743463 (1988-05-01), Ronn et al.
patent: 4752455 (1988-06-01), Mayer
patent: 4895735 (1990-01-01), Cook
patent: 4970196 (1990-11-01), Kim et al.
patent: 4987006 (1991-01-01), Williams et al.
patent: 5065697 (1991-11-01), Yoshida
patent: 5173441 (1992-12-01), Yu et al.
patent: 5231047 (1993-07-01), Ovshinsky et al.
patent: 5292559 (1994-04-01), Joyce et al.
W. Marine, et al., Laser Ablation of Electronic Materials p. 89, Elsevier Publishing-EMRS Monographs vol. 4, 1992.
R. J. von Gutfeld, et al., Appl. Phys. Lett., 35(9) 1979 "Laser Enhanced Electroplating and Maskless . . . ".
R. T. Hodgson, et al., IBM Tech. Discl. Bulletin, vol. 21, #10, 1979, "Ohmic Contacts Made by Lasers".
J. P. Coullahan et al., IBM, Tech. Discl. Bulletin, vol. 22, #6, 1979 "Chip Passivation Technique".
J. Bohandy, et al., "Metal deposition at 532 nm using a laser technique," J. Appl. Phys. vol. 63(4), Feb. 15, 1988, pp. 1158-1162.
J. Bohandy, et al., "Metal deposition from a supported metal film using an excimer laser," J. Appl. Phys. vol. 60(4), Aug. 15, 1986, pp. 1538-1539.
F. J. Adrian, et al., "A study of the mechanism of metal deposition by the laser-induced forward transfer process" J. Vac. Sci. Technol. B, vol. 5, No. 5, Sep./Oct 1987, pp. 1490-1494.
V. Schultze et al., "Laser-induced forward transfer of aluminum," Applied Surface Science vol. 52 (1991), pp. 303-309.
R. J. Baseman, et al., "Laser induced forward transfer," Symp. Mat. Res. Soc. 1988, pp. 237-242 Laser and Particle Beam, Chemical Processing for Microelectronics.
P. Matossi, Lehrbuch der Experimentalphysik, "Band III, Optik,"Walter de Gruyter & Co., Berlin 1966, pp. 108-113.
E. Fogarassy, et al., "Laser-induced forward transfer of high-T.sub.c YBsaCuO and BiSrCaCuO superconducting thin films," Journal of Applied Physics vol. 66(1), Jul. 1, 1989, pp. 457-459.
Deutsche Forschungsanstalt fuer Luft-und Raumfahrt e.V.
Hearn Brian E.
Lipsitz Barry R.
Radomsky Leon
LandOfFree
Process for applying structured layers using laser transfer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for applying structured layers using laser transfer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for applying structured layers using laser transfer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1355779