Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1994-05-25
1996-04-23
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566511, 1566571, 15665911, 216 67, H01L 21306
Patent
active
055099955
ABSTRACT:
A process of anisotropically etching a semiconductor material, capable of preventing contamination of the semiconductor material and thereby improving the yield of a semiconductor integrated circuit finally fabricated. The process includes a primary etching step of slantly etching a semiconductor layer, formed to be interposed between a lower layer and a photoresist pattern on a semiconductor substrate and partially exposed by the photoresist pattern, at a predetermined angle by using a primary plasma gas ionized by an electric field, thereby selectively exposing the lower layer, and a secondary etching step of directly applying a secondary plasma gas ionized by the electric field to sloped surfaces of the semiconductor layer formed at the primary etching step and scattering the secondary plasma gas toward the sloped surfaces of the semiconductor layer by the exposed portion of the lower layer, whereby the sloped surfaces of the semiconductor layer is vertically etched.
REFERENCES:
patent: 4460435 (1984-07-01), Maa
patent: 4487652 (1984-12-01), Almgren
patent: 4676869 (1987-06-01), Lee et al.
patent: 4889588 (1989-12-01), Fior
patent: 5236549 (1993-08-01), Shirakawa et al.
Hyundai Electronics Industries Co,. Ltd.
Powell William
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