Process for adhesively attaching a temporary lid to a microelect

Details Process for adhesively attaching a temporary lid to a microelect Process for adhesively attaching a temporary lid to a microelect

1998-01-22

2000-04-25

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563066, 29832, B32B 3104

Patent

active

060540087

ABSTRACT:
A process and apparatus for picking up and moving a microelectronic package during card assembly operations. A temporary lid having a top surface and a bottom surface attaches to at least one microchip on a substrate via a double-sided adhesive. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. After completion of the steps where vacuum probe movement is required, the lid and adhesive may be removed from the at least one microchip by pulling them both off together. No residue is left on the microchips.

REFERENCES:
patent: 5407865 (1995-04-01), Glovatsky et al.
patent: 5477009 (1995-12-01), Brendecke et al.
patent: 5667884 (1997-09-01), Bolger
patent: 5706579 (1998-01-01), Ross
patent: 5789810 (1998-08-01), Gross et al.
patent: 5868887 (1999-02-01), Sylvester et al.
patent: 5880524 (1999-03-01), Xie

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