Process for ablating high density vias in flexible substrate

Details Process for ablating high density vias in flexible substrate Process for ablating high density vias in flexible substrate

1995-09-29

1997-12-30

Tentoni, Leo B.

Plastic and nonmetallic article shaping or treating: processes

Laser ablative shaping or piercing

264 39, 264101, B23K 2600

Patent

active

057026629

ABSTRACT:
A apparatus and process for ablating a matrix of high density vias in a flexible substrate. The apparatus is cantilevered on a horizontal shelf from a partition where it can be rigidly supported. A vacuum container reciprocates towards and away from the partition and supports the horizontal shelf by permitting supporting casters to bear on and be supported by the reciprocating container. When the container is away from the partition, servicing of the apparatus as well as the insertion an removal of substrate can occur. When the container is adjoined to the partition, a vacuum can be drawn on the apparatus and processing commenced. A continuous flexible substrate is provided extending in a circuitous path between a supply roll and a take up roll, all interior of the container. The flexible substrate is maintained under constant tension and incrementally advanced. The substrate is incrementally advanced and stopped, passing across a table. When the roll is advanced, the table releases the substrate and is cleaned of the debris resulting form previous ablations. When the roll is stopped, the table clamps and precisely levels the substrate for sequential ablation of the substrate.

REFERENCES:
patent: 5362940 (1994-11-01), MacDonald et al.
patent: 5481407 (1996-01-01), Smith et al.
patent: 5571429 (1996-11-01), Smith et al.

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