Process endpoint detection method using broadband reflectometry

Details Process endpoint detection method using broadband reflectometry Process endpoint detection method using broadband reflectometry

2005-12-27

2005-12-27

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Reexamination Certificate

active

06979578

ABSTRACT:
A method of determining a parameter of interest during processing of a patterned substrate includes obtaining a measured net reflectance spectrum resulting from illuminating at least a portion of the patterned substrate with a light beam having a broadband spectrum, calculating a modeled net reflectance spectrum as a weighted incoherent sum of reflectances from different regions constituting the portion of the patterned substrate, and determining a set of parameters that provides a close match between the measured net reflectance spectrum and the modeled net reflectance spectrum. For wavelengths below a selected transition wavelength, a first optical model is used to calculate the reflectance from each region as a weighted coherent sum of reflected fields from thin film stacks corresponding to laterally distinct areas constituting the region. For wavelengths above the transition wavelength, a second optical model based on effective medium approximation is used to calculate the reflectance from each region.

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