Process and system for coating a substrate

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

20429822, C23C 1434, C23C 1435

Patent

active

055587500

ABSTRACT:
A coating system has, in a housing (1), a sputtering chamber (3) for the coating of a substrate (22) and a target carrier coating chamber (4) for the continuous coating of a rotating target carrier (2) with a coating of target material (25), which projects into both chambers (3, 4). The surface of the carrier which has been coated in the target carrier coating chamber (4) passes continuously through the sputtering chamber (3). The previously produced coating forms the target for the sputtering process in the sputtering chamber (3).

REFERENCES:
patent: 4443318 (1984-04-01), McKeley
patent: 4866032 (1989-09-01), Fujimori et al.
patent: 5215638 (1993-06-01), Hausler
patent: 5405517 (1995-04-01), Lampkin

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