Process and device for unsoldering semiconductor modules in the

Details Process and device for unsoldering semiconductor modules in the Process and device for unsoldering semiconductor modules in the

1976-06-14

1978-01-03

Kelly, Donald G.

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228 6A, 228 20, H05L 2170, B23K 300

Patent

active

040662047

ABSTRACT:
A method and device for unsoldering semiconductor modules which are soldered onto terminal surfaces of a carrier by terminals pads composed of soft solder is disclosed herein. A suction cup is placed onto a semiconductor module to be unsoldered and the terminal pads are melted. The suction cup is raised together with the semiconductor module, and, with a burst of compressed air, the semiconductor module is removed. The suction cup is then lowered onto the terminal surfaces and soft solder residues are melted and sucked away.

REFERENCES:
patent: 3372263 (1968-03-01), Lemelson
patent: 3382564 (1968-05-01), Gallentine
patent: 3434455 (1969-03-01), Maytone
patent: 3561662 (1971-02-01), Duhaime et al.
patent: 3930295 (1976-01-01), Rose
Drexinger "Repair of Integrated Circuits" Technical Digest No. 3 July 1966, Western Electric p. 11.

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