4. Metal fusion bonding
  5. Process of disassembling bonded surfaces, per se

Oskar Wirbser

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Process and device for unsoldering semiconductor modules in the

Metal fusion bonding – Process of disassembling bonded surfaces – per se
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UV-curable adhesive semiconductor chip mounting process

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Profile ID: LFUS-PAI-P-475789

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