Process and device for polishing semiconductor wafers

Details Process and device for polishing semiconductor wafers Process and device for polishing semiconductor wafers

1998-10-28

2000-08-01

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

451 5, 451 8, 451 41, 451 53, B24B 4914, B24B 100

Patent

active

060958987

ABSTRACT:
A process and device for polishing semiconductor wafers has at least one side of at least one semiconductor wafer pressed against a polishing plate, over which a polishing cloth is stretched. The semiconductor wafer and the polishing plate are moved relative to each other to polish the wafer. During the polishing, the semiconductor wafer passes over at least two regions on the polishing plate, which regions have defined radial widths and are at different temperatures. Temperature-control means are provided in the polishing plate, with the aid of which the number, the radial widths and the temperatures of the regions are fixed before the semiconductor wafers are polished.

REFERENCES:
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4471579 (1984-09-01), Bovensiepen
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5718620 (1998-02-01), Tanaka et al.
patent: 5873769 (1999-02-01), Chiou et al.
Patent Abstracts of Japan, vol. 010, No. 051 (H-457), Feb. 28, 1986, & JP 201868 A (Hitachi Seisakado KK), Oct. 12, 1985.

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