Process and device for one-sided treatment of disk-shaped object

Details Process and device for one-sided treatment of disk-shaped object Process and device for one-sided treatment of disk-shaped object

1998-03-11

2000-11-21

Utech, Benjamin L.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

438706, 438716, H01L 21302

Patent

active

061497592

ABSTRACT:
For one-sided etching of silicon wafer 8 in the dry-etching process, a dee is provided that consists of a cap-shaped housing 1 and a holding plate 7, attached to the latter, for silicon wafer 8 that is to be etched in a process chamber 5, into which a medium in gaseous form that exerts an etching action can be introduced. In holding plate 7 is an indentation 9, around which holding pins 11 for silicon wafer 8 and suction openings 12 are arranged to remove gas from process chamber 5. Silicon wafer 8 that is to be treated is placed with its side 20 that is to be etched upward on holding plate 7, and a medium in gaseous form that is inert with respect to the layer that is to be removed by etching is introduced into indentation 9 in holding plate 7.

REFERENCES:
patent: 4165252 (1979-08-01), Gibbs
patent: 4350562 (1982-09-01), Bonii
patent: 5100495 (1992-03-01), Ohmi et al.
patent: 5478401 (1995-12-01), Tsunekawa et al.
patent: 5580421 (1996-12-01), Hiatt et al.

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