Process and apparatus for individual pin repair in a dense array

Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse

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228264, B23K 3100

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active

046322949

ABSTRACT:
The disclosure is directed to process and apparatus for the removal, site preparation, and replacement of any single connector pin contained within a sizeable array of closely spaced very small connector pins on an electronic packaging structure (substrate or module) without causing deleterious metallurgical effects either to the remaining pins or the ceramic substrate.

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