Fishing – trapping – and vermin destroying
Patent
1992-04-30
1993-12-28
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437208, 437211, H01L 2128, H01L 2170, H01L 2156, H01L 2160
Patent
active
052739384
ABSTRACT:
A low cost manufacturing method is used to fabricate a small multichip semiconductor device (30). In one embodiment, a pattern of conductive traces (13) is formed on a film of transfer material (12). A first semiconductor die (15) is interconnected to the traces and a resin body (20) is formed around the first die and one side of the traces. The film of transfer material forms, at this stage of the process, one side of the first package. The film of transfer material is then peeled from the pattern of conductive traces and the first resin body to expose the other side of the traces. A second semiconductor die (23) is interconnected to the exposed side of the traces. A second resin body (25) is formed around the second die and portions of the exposed traces. Solder balls (26) are coupled to the exposed portions of the traces to establish external electrical connections to each die.
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patent: 4530152 (1985-07-01), Roche et al.
patent: 4635356 (1987-01-01), Ohuchi et al.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 4961105 (1990-10-01), Yamamoto
patent: 5122860 (1992-06-01), Kikuchi et al.
Lin Paul T.
McShane Michael B.
Chaudhuri Olik
Goddard Patricia S.
Graybill David E.
Motorola Inc.
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