Process and apparatus for forming oxide film, and electronic...

Details Process and apparatus for forming oxide film, and electronic... Process and apparatus for forming oxide film, and electronic...

2006-08-24

2009-12-15

Menz, Douglas M (Department: 2891)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C438S778000

Reexamination Certificate

active

07632758

ABSTRACT:
An oxide film-forming apparatus, comprising: a process chamber for disposing an electronic device substrate at a predetermined position; water vapor supply means for supplying water vapor into the process chamber; and plasma exciting means for activating the water vapor with plasma, whereby the surface of the electronic device substrate can be irradiated with the plasma based on the water vapor.

REFERENCES:
patent: 6358867 (2002-03-01), Tews et al.
patent: 6399520 (2002-06-01), Kawakami et al.
patent: 2002/0014666 (2002-02-01), Ohmi et al.
patent: 2001-160555 (2001-06-01), None
patent: 2002-246386 (2002-08-01), None
Japanese Office Action mailed on Aug. 12, 2008 in Japanese Application No. 2003-146228.

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