Process and apparatus for fabricating a semiconductor wafer

Details Process and apparatus for fabricating a semiconductor wafer Process and apparatus for fabricating a semiconductor wafer

1997-04-25

1998-12-08

Scherbel, David A.

Stone working

Sawing

125 1301, 451273, 451274, 451290, B28D 102

Patent

active

058456309

ABSTRACT:
A process for fabricating a semiconductor wafer and an apparatus for chamfering a semiconductor ingot are provided to precisely perform the chamfering together and reduce significantly the cutting and chamfering time. The semiconductor ingot 2 is rotated with respect to the central axis C while the circumferential surface 21 of the rotating ingot 2 is brought in contact with the uneven surface 11 of a grindstone 1. The circumferential surface of the ingot is chamfered in accordance with the uneven surface 11 of the grindstone 1. A wiresaw is used to cut the semiconductor ingot 2 to obtain the sliced wafers 3.

REFERENCES:
patent: 3475867 (1969-11-01), Walsh
patent: 3831576 (1974-08-01), Mech
patent: 4331452 (1982-05-01), Causey et al.
patent: 5087307 (1992-02-01), Nomura et al.
patent: 5564409 (1996-10-01), Bonzo et al.

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