Process and apparatus for etching semiconductor wafers

Details Process and apparatus for etching semiconductor wafers Process and apparatus for etching semiconductor wafers

1993-10-08

1994-08-23

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156662, H01L 21306, B44C 122

Patent

active

053404378

ABSTRACT:
Process for etching a semiconductor wafer which includes the steps of rotating the wafer, and contacting the rotating wafer with a flowing froth, the froth being formed, at least in part, by the effervescence of a pressurized etchant containing a dissolved gas.

REFERENCES:
patent: 3880409 (1974-01-01), Bok et al.
patent: 3964957 (1976-06-01), Walsh
patent: 4251317 (1981-02-01), Foote
patent: 4840701 (1989-06-01), Stern
patent: 4900395 (1990-02-01), Swerson et al.
patent: 4971654 (1990-11-01), Schnegg et al.
patent: 5211794 (1993-05-01), Enomoto et al.
patent: 5236548 (1993-08-01), Stadler et al.
patent: 5246528 (1993-09-01), Hasegawa et al.

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