Process and apparatus for etching printed circuit boards

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156345, 156637, 156642, 156666, 156901, 204186, 204302, C23F 100, B44C 122, C03C 1500, C03C 2506

Patent

active

045954518

ABSTRACT:
There is disclosed a process and apparatus for etching printed board circuits wherein etching of a printed circuit board is effected in turbulent flow of the etching solution and wherein concentration of the etching solution is maintained at effective levels by electrolysis.

REFERENCES:
patent: 3880409 (1975-04-01), Bok et al.
patent: 4073708 (1978-02-01), Hicks
patent: 4482425 (1984-11-01), Battey

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