Process and apparatus for applying orienting layers to a substra

Details Process and apparatus for applying orienting layers to a substra Process and apparatus for applying orienting layers to a substra

1995-10-11

1997-08-19

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419212, 20419215, 20429811, 20429817, 20429823, 20429826, C23C 1434

Patent

active

056584393

ABSTRACT:
A process of making an orienting layer on a substrate for aligning liquid crystal molecules, especially of a large-scale liquid crystal display, includes moving the substrate (14) at a distance of 50 to 100 mm from a target (11) past the target in a substrate motion direction (15) and providing the target with a length l in a direction perpendicular to the substrate motion direction and parallel to the substrate surface (S) at least equal to the width s of the substrate (14); sputtering material from the target (11) onto the substrate surface (S) by forming a gas plasma in a vacuum chamber containing the target; and orienting the target (14) relative to the substrate so that the cathode surface (CS) of the target is inclined at a surface inclination angle a of from 60.degree. to 85.degree. to the substrate surface so that the material is sputtered obliquely onto the substrate surface to form the orienting layer. Another target (12) may be provided for forming an insulating layer prior to forming the orienting layer

REFERENCES:
patent: 5350498 (1994-09-01), Smith, Jr.
T. Motohiro, et al. Thin Solid Films, vol. 185 pp. 137-144 (1990).

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