Probe sheet and method of manufacturing the same

Details Probe sheet and method of manufacturing the same Probe sheet and method of manufacturing the same

1996-01-24

1998-12-01

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

216 2, 216 86, 216 99, 324724, 438 18, 438740, H01L 2100

Patent

active

058438440

ABSTRACT:
Insulation films which include a bump formation portion are formed on a semiconductor layer which serves as a thin layer. Metallic wire patterns are formed to fill up the bump formation portion, on the insulation film. The insulation film, the metallic wire pattern and the insulation film are formed in this order on the metallic wire pattern. A bump made of Ni is formed on a lower surface of the bump formation portion of the metallic wire pattern.

REFERENCES:
patent: 4566184 (1986-01-01), Higgins et al.
patent: 4994735 (1991-02-01), Leedy
patent: 5092033 (1992-03-01), Nishiguchi et al.

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