Probe pad, substrate having a semiconductor device, method...

Details Probe pad, substrate having a semiconductor device, method... Probe pad, substrate having a semiconductor device, method...

2005-05-17

2009-11-10

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07616020

ABSTRACT:
In an embodiment, a semiconductor device is tested using a probe pad that includes a probing region with which a probe needle makes contact, and a sensing region bordering an edge of the probing region. Electrical signals are applied, and measured results indicate the probe needle's location relative to a test position on the semiconductor device.

REFERENCES:
patent: 5065092 (1991-11-01), Sigler
patent: 5187020 (1993-02-01), Kwon et al.
patent: 5554940 (1996-09-01), Hubacher
patent: 5969530 (1999-10-01), Yamashita
patent: 7170189 (2007-01-01), Takahashi et al.
patent: 08-111431 (1996-04-01), None
patent: 10-189671 (1998-07-01), None
patent: 2002-176140 (2002-06-01), None
patent: 1996-0043062 (1996-12-01), None
patent: 1999-0071141 (1999-09-01), None
English language abstract of Japanese Publication No. 08-111431, Apr. 30, 1996.
English language abstract of Japanese Publication No. 10-189671, Jul. 21, 1998.
English language abstract of Korean Publication 1996-0043062, Dec. 21, 1996.
English language abstract of Korean Publication No. 1999-0071141, Sep. 15, 1999.

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