Probe device and method of regulating contact pressure...

Details Probe device and method of regulating contact pressure... Probe device and method of regulating contact pressure...

2006-08-23

2010-12-07

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S757020, C324S1540PB

Reexamination Certificate

active

07847569

ABSTRACT:
Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe card2has a contactor11for supporting a probe10, a printed wiring board13electrically connected to the contactor11, and a reinforcement member14. On the upper surface side of the probe card2is provided a top plate70connected to the reinforcement member14by a connection member80. A groove90is formed in the upper surface of the top plate70, and a strain gauge91is attached at the groove90. When a wafer W and the probe10are in contact with each other, an upward load acts on the probe card2by pressure caused by the contact, and the load causes strain in the top plate70. The amount of the strain in the top plate70is measured, and contact pressure between the wafer W and the probe10is regulated and set based on the amount of the strain.

REFERENCES:
patent: 4749942 (1988-06-01), Sang et al.
patent: 5939893 (1999-08-01), Elsner et al.
patent: 6137299 (2000-10-01), Cadieux et al.
patent: 7262618 (2007-08-01), Komatsu
patent: 2008/0048698 (2008-02-01), Amemiya et al.
patent: 04-320969 (1992-11-01), None
patent: 10-010156 (1998-01-01), None
Korean Office action for 10-2008-7003711 dated Jan. 28, 2010.
Japanese Office action for 2005-244840 dated Jun. 1, 2010.

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