Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-07-31
2007-07-31
Karlsen, Ernest (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S757020, C324S765010
Reexamination Certificate
active
10742729
ABSTRACT:
A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing apparatus, such as a wafer probe handler, in electrical communication with test circuitry. The probe card includes an interconnect substrate having contact members for establishing electrical communication with contact locations on the wafer. The probe card also includes a membrane for physically and electrically connecting the interconnect substrate to the testing apparatus, and a compressible member for cushioning the pressure exerted on the interconnect substrate by the testing apparatus. The interconnect substrate can be formed of silicon with raised contact members having penetrating projections. Alternately the contact members can be formed as indentations for testing bumped wafers. The membrane can be similar to multi layered TAB tape including metal foil conductors attached to a flexible, electrically-insulating, elastomeric tape. The probe card can be configured to contact all of the dice on the wafer at the same time, so that test signals can be electronically applied to selected dice as required.
REFERENCES:
patent: 3866119 (1975-02-01), Ardezzone et al.
patent: 3867693 (1975-02-01), Saxenmeyer, Sr.
patent: 4518914 (1985-05-01), Okubo et al.
patent: 4597617 (1986-07-01), Enochs
patent: 4795977 (1989-01-01), Frost et al.
patent: 4891585 (1990-01-01), Janko et al.
patent: 4906920 (1990-03-01), Huff et al.
patent: 4918383 (1990-04-01), Huff et al.
patent: 4952272 (1990-08-01), Okino et al.
patent: 5020219 (1991-06-01), Leedy
patent: 5034685 (1991-07-01), Leedy
patent: 5049813 (1991-09-01), Van Loan et al.
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5124639 (1992-06-01), Carlin et al.
patent: 5166602 (1992-11-01), Byford et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5177439 (1993-01-01), Liu et al.
patent: 5180977 (1993-01-01), Huff
patent: 5264787 (1993-11-01), Woith et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5329226 (1994-07-01), Monnet et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5412329 (1995-05-01), Iino et al.
patent: 5419807 (1995-05-01), Akram et al.
patent: 5451489 (1995-09-01), Leedy
patent: 5461326 (1995-10-01), Woith et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5510723 (1996-04-01), Canella et al.
patent: 5517126 (1996-05-01), Yamaguchi
patent: 5521522 (1996-05-01), Abe et al.
patent: 5578526 (1996-11-01), Akram et al.
patent: 5606267 (1997-02-01), Yoshizawa
patent: 5607818 (1997-03-01), Akram et al.
patent: 5686317 (1997-11-01), Akram et al.
patent: 5701666 (1997-12-01), De Haven et al.
patent: 5703494 (1997-12-01), Sano
patent: 5716218 (1998-02-01), Farnworth et al.
patent: 5825192 (1998-10-01), Hagihara
patent: 5869974 (1999-02-01), Akram et al.
patent: 5894161 (1999-04-01), Akram et al.
patent: 5952843 (1999-09-01), Vinh
patent: 6005401 (1999-12-01), Nakata et al.
patent: 6060891 (2000-05-01), Hembree et al.
patent: 6068669 (2000-05-01), Farnworth et al.
patent: 6072321 (2000-06-01), Akram et al.
patent: 6275052 (2001-08-01), Hembree et al.
patent: 6356098 (2002-03-01), Akram et al.
patent: 6359456 (2002-03-01), Hembree et al.
patent: 6469537 (2002-10-01), Akram et al.
patent: 6798224 (2004-09-01), Hembree et al.
patent: 2 293 268 (1996-03-01), None
patent: 3-69131 (1991-03-01), None
patent: 7-159485 (1995-06-01), None
patent: 8-50146 (1996-02-01), None
patent: 8-5666 (1996-12-01), None
“Cobra™ technology makes Wentworth Labs the world's most advanced probe card manufacturer”. Wentworth Laboratories advertising brochure, (month unavailable), 1996.
“Science Over Art, Our new IC Membrane Test Probe”. Packard Hughes Interconnect, advertising brochure, (month unavailable), 1996.
Akram Salman
Doherty C. Patrick
Hembree David R.
Krivy Andrew J.
Wood Alan G.
Gratton Stephen A.
Karlsen Ernest
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