Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2002-08-29
2004-08-10
Chambliss, Alonzo (Department: 2827)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S018000, C438S110000, C438S113000, C438S459000, C438S611000, C257S048000, C324S437000, C324S754090, C324S757020, C324S758010, C439S169000
Reexamination Certificate
active
06773938
ABSTRACT:
BACKGROUND
The present invention provides certain improvements in microelectronic component testing. More particularly, the present invention provides probe cards of the type which may be used in testing microelectronic components. These probe cards are not limited to microelectronic component testing, though, and have utility in a variety of other applications, as well.
The microelectronics industry is highly competitive and most microelectronics manufacturers are highly sensitive to quality and cost considerations. Most microelectronics manufacturers require that suppliers of microelectronic components test performance of each microelectronic component before shipment to minimize the manufacturer's product losses. Microelectronics are commonly tested by establishing temporary electrical connections between a test system and electrical contacts on the microelectronic component.
One way of establishing a temporary electrical connection between the test system and the contacts on the microelectronic component employs a probe card carrying a plurality of probe pins. The probe pins are typically either a length of wire or a relatively complex spring-biased mechanism, e.g., POGO PINS, commercially available from Pogo Industries of Kansas City, Kans., USA. The probe pins are individually formed then inserted in a pin mounting plate in which an array of holes has been precisely machined. This is a fairly laborious, expensive process. The process becomes even more complex as microelectronic components move to progressively finer contact pitches, which require the probe pins to be spaced closer and closer to one another.
REFERENCES:
patent: 5447264 (1995-09-01), Koopman et al.
patent: 5739050 (1998-04-01), Farnworth
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 5894218 (1999-04-01), Farnworth et al.
patent: 6018249 (2000-01-01), Akram et al.
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6072323 (2000-06-01), Hembree et al.
patent: 6078186 (2000-06-01), Hembree et al.
patent: 6081429 (2000-06-01), Barrett
patent: 6094058 (2000-07-01), Hembree et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6150717 (2000-11-01), Wood et al.
patent: 6163956 (2000-12-01), Corisis
patent: 6188232 (2001-02-01), Akram et al.
patent: 6198172 (2001-03-01), King et al.
patent: 6208156 (2001-03-01), Hembree
patent: 6247629 (2001-06-01), Jacobson et al.
patent: 6255833 (2001-07-01), Akram et al.
patent: 6285204 (2001-09-01), Farnworth
patent: 6294839 (2001-09-01), Mess et al.
patent: 6356098 (2002-03-01), Akram et al.
patent: 6566898 (2003-05-01), Theissen et al.
patent: 6586955 (2003-07-01), Fjelstad et al.
patent: 2003/0003724 (2003-01-01), Uchiyama et al.
patent: 2003/0010976 (2003-01-01), Grube et al.
patent: 2000321302 (2000-11-01), None
patent: WO 01/67116 (2001-09-01), None
Schott Corporation, Technical Glass Division, “FOTURAN® photo-etchable glass,” http://www.us.schott.com/tgd/english/products/foturan.html (Dec. 5, 2002), 2 pages, Yonkers, New York, 2002.
Advanced Coating, “What is Parylene?” http://www.conformal-coating.com/parylene_coating.htm (Dec. 5, 2002), 3 pages, Rancho Cucamonga, California, 2000.
Doan Trung T.
Hembree David R.
Wood Alan G.
Chambliss Alonzo
Perkins Coie LLP
LandOfFree
Probe card, e.g., for testing microelectronic components,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Probe card, e.g., for testing microelectronic components,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Probe card, e.g., for testing microelectronic components,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3287809