Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1983-11-10
1985-07-09
Kittle, John E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430313, 430315, 430319, 204 15, G03C 500, G03F 726
Patent
active
045282595
ABSTRACT:
In a printed wiring board of the type that places a solder mask over bare copper circuit traces, the solder mask is laid down with a flat planar surface by means of a liquid photopolymer solder mask layer deposited, photoexposed and developed to uncover those circuit trace positions such as through holes and connector pads for further processing. Then a very thin copper layer is chemically deposited over the surface area and a resist layer is laid down as a cover insulating layer on the flat surface so that a thicker layer of copper may be electrolytically plated over the uncovered circuit traces. In this manner the conductive area about each of the connector pads is significantly increased by plating on the sidewalls of the solder mask layer which surround the connector pads. Additionally the photopolymer flat surface is glossy and does not strongly adhere to the deposited thin copper layer as does the sidewall and conductor pad areas, thereby permitting the cover insulating layer and the thin copper layer to be readily removed from the flat planar surface by mechanical methods.
REFERENCES:
patent: 4054483 (1977-10-01), Peiffer
patent: 4260675 (1981-04-01), Sullivan
patent: 4424089 (1984-01-01), Sullivan
patent: 4436806 (1984-03-01), Rendulic et al.
Brown Laurence R.
Dees Jos,e G.
Kittle John E.
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