Printed wiring boards

Details Printed wiring boards Printed wiring boards

1982-01-04

1982-09-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

279852, 134 1, 156645, 156656, 1566591, 156901, 204 15, 204 32R, 204192EC, 427 97, 427250, 427307, 427328, 430313, 430318, C23F 102

Patent

active

043516971

ABSTRACT:
A printed circuit board is made from a substrate having a copper clad layer thereon by means of first providing spaced through-holes through the substrate, mechanically scrubbing the surface of the substrate and then sputter etching the surface of the substrate so as to remove at least 50A. thereof from the surface and then vacuum metallizing the through-holes subsequent to sputter etching without breaking the vacuum and then finally forming a circuit pattern on the substrate by usual subtractive techniques.

REFERENCES:
patent: 3539407 (1970-11-01), Frantzen
patent: 3984907 (1976-10-01), Vossen et al.
patent: 4087314 (1978-05-01), George et al.
patent: 4097636 (1978-01-01), Hawrylo et al.
patent: 4135988 (1979-01-01), Dugan et al.
patent: 4234622 (1980-11-01), DuBuske et al.
patent: 4243865 (1981-01-01), Saxena
patent: 4247579 (1981-01-01), Tuft
J. Vac. Sci. Technol., Vol. 11, No. 5, Sep./_Oct. 1974, A Sputtering Technique for Coating the Inside Walls of Through-Holes in Substrates by J. L. Vossen, pp. 875-877.

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