Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2010-12-13
2011-10-11
Nguyen, Hoa C (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S762000, C361S783000, C361S768000, C361S771000
Reexamination Certificate
active
08035979
ABSTRACT:
A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.
REFERENCES:
patent: 7307852 (2007-12-01), Inagaki et al.
patent: 7435910 (2008-10-01), Sakamoto et al.
patent: 2002/0159243 (2002-10-01), Ogawa et al.
patent: 2003/0090883 (2003-05-01), Asahi et al.
patent: 2003/0150641 (2003-08-01), Kinayman et al.
patent: 2003/0183920 (2003-10-01), Goodrich et al.
patent: 2004/0014317 (2004-01-01), Sakamoto et al.
patent: 2005/0157478 (2005-07-01), Inagaki et al.
patent: 2006/0003495 (2006-01-01), Sunohara et al.
patent: 2006/0087020 (2006-04-01), Hirano et al.
patent: 2006/0138591 (2006-06-01), Amey et al.
patent: 2001-044641 (2001-02-01), None
patent: 2002-344146 (2002-11-01), None
patent: 2005-039094 (2005-02-01), None
patent: 10-0488412 (2005-05-01), None
Korean Office Action issued on Feb. 7, 2011, in the corresponding Korean Patent Application No. 10-2007-7028717.
Araki Makoto
Enomoto Minoru
Goto Masakatsu
Kadono Shinji
Kawamoto Mineo
CMK Corporation
Nguyen Hoa C
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Renesas Eastern Japan Semiconductor Inc.
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