Printed wiring board, method for forming the printed wiring...

Details Printed wiring board, method for forming the printed wiring... Printed wiring board, method for forming the printed wiring...

2008-10-03

2010-11-09

Walke, Amanda C. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S313000, C430S319000, C430S322000, C430S324000, C430S331000

Reexamination Certificate

active

07829265

ABSTRACT:
A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.

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patent: 6809415 (2004-10-01), Tsukada et al.
patent: 2002/0045135 (2002-04-01), Watanabe
patent: 2006/0244140 (2006-11-01), Hu
patent: 2008/0138505 (2008-06-01), Takai et al.
patent: 08-023147 (1996-01-01), None
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patent: 2000-228580 (2000-08-01), None
patent: 2001-332582 (2001-11-01), None
patent: I243007 (2005-11-01), None

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