Printed wiring board manufacturing method

Details Printed wiring board manufacturing method Printed wiring board manufacturing method

2005-10-03

2008-07-29

Culbert, Roberts (Department: 1792)

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

C029S852000

Reexamination Certificate

active

07404908

ABSTRACT:
According to this manufacturing method, a copper foil is attached to both sides of an insulating material to form a substrate. First, a large number of through-holes is made in the substrate and the inside of the through-holes is made electrically conductive. Then, after one side of the substrate is coated with a photosensitive dry film having an outer masking layer attached thereto, a developing solution is caused to infiltrate into the through-bores from the other side to develop the photosensitive dry film as a plating resist. The photosensitive dry film is then exposed to be hardened. The outer masking layer is removed to copper-electroplate the inside of the through-holes and the like. Finally, the photosensitive dry film is removed to form a circuit pattern.

REFERENCES:
patent: 4889790 (1989-12-01), Roos et al.
patent: 06177505 (1994-06-01), None
patent: 11-195849 (1999-07-01), None

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