Method and apparatus for cooling a memory device

Details Method and apparatus for cooling a memory device Method and apparatus for cooling a memory device

2006-07-11

2008-07-15

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S710000, C361S719000, C361S721000, C165S080300, C165S104330, C165S185000, C257S717000, C257S718000, C174S016300, C174S252000

Reexamination Certificate

active

07400506

ABSTRACT:
A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.

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