Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1988-06-27
1991-02-19
Dees, Jose G.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430318, 430319, 430329, 204 15, G03F 700
Patent
active
049943499
ABSTRACT:
The specification describes a process for making a plating mask (17), for use in printed wiring board fabrication, with greater precision and definition than has previously been possible. An insulative substrate (11) includes on one surface a thin metal film (13). The film is covered with a relatively thick first mask layer (16) which is selectively removed to expose portions of the metal film, which are in turn removed to expose portions of the insulative substrate (11). The exposed portions of the insulative substrate are covered with a relatively thick plating mask layer (17) which abuts against the first mask layer (16). The first mask layer is then removed, leaving the remaining plating mask layer as a patterned plating mask which is then used as a mask for deposited metal (19) which defines a printed circuit.
REFERENCES:
patent: 3390061 (1968-06-01), Levinos
patent: 3980483 (1976-09-01), Nishikubo et al.
patent: 4606788 (1986-08-01), Moran
patent: 4707394 (1987-11-01), Chant
patent: 4746399 (1988-05-01), Demmer et al.
patent: 4751172 (1988-06-01), Rodriquez et al.
patent: 4861438 (1989-08-01), Banks et al.
Draper, Printed Circuits and Electronics Assemblies, Robert Draper Ltd., Teddingten, Great Britian, Oct. 1969.
Fefferman, "A UV-Curable Solder Mask . . . ", Proc. Electr/Electron Insul. Conf., 1977, vol. 13, pp. 97-101.
Printed Circuits Handbook, Clyde F. Coombs, Jr., McGraw-Hill Book Company, 1979, New York, pp. 7-33 thru 7-35 (Second Edition).
Blumenstock Brent J.
Ors Jose A.
Anderson R. B.
AT&T Bell Laboratories
Dees Jos,e G.
LandOfFree
Printed wiring board fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed wiring board fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board fabrication method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1142847