Printed wiring board design aiding apparatus, printed wiring...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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Details

C716S030000, C716S030000, C703S002000

Reexamination Certificate

active

11167264

ABSTRACT:
The present invention provides a printed wiring board design aiding apparatus, method, and program that can easily and inexpensively predict the displacement of a printed wiring board of complicated shape and configuration due to temperature change. The printed wiring board design aiding program makes a computer execute the steps including a mesh division step that divides an analytical model of a printed wiring board obtained as data into meshes, a mesh displacement calculation step that calculates displacements of respective meshes of a printed wiring board which is divided in the mesh division step, a mesh displacement connection step that connects mesh displacements calculated in the mesh displacement calculation step so that the inclination of borders of respective meshes become equal, and a displacement calculation step that calculates a displacement using an entire displacement of a printed wiring board which is obtained in the mesh displacement connection step.

REFERENCES:
patent: 5868887 (1999-02-01), Sylvester et al.
patent: 5888630 (1999-03-01), Sylvester et al.
patent: 7139678 (2006-11-01), Kobayashi et al.
patent: 7222316 (2007-05-01), Fukuzono et al.
patent: 6-349917 (1994-12-01), None
patent: 2004-13437 (2004-01-01), None
patent: 2005-050137 (2005-02-01), None

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