Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2003-02-19
2004-03-23
Baxter, Janet (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S311000, C430S325000, C430S326000, C430S270100, C430S281100, C430S283100, C430S288100, C430S915000, C430S920000, C522S173000, C522S031000, C522S050000, C522S053000, C522S063000, C522S070000
Reexamination Certificate
active
06709804
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a photosensitive resin composition, a printed wiring board, a substrate for disposing semiconductor chips, a semiconductor device and processes for producing a printed wiring substrate, a substrate for disposing semiconductor chips and a semiconductor device. More particularly, the present invention relates to a photosensitive resin composition of the negative type which can be applied to production of semiconductor elements and circuit wiring boards, can exhibit high sensitivity and high resolution and can form resin layers having excellent heat resistance; a printed wiring substrate, a substrate for disposing semiconductor chips and a semiconductor device obtained by using the photosensitive resin composition; and processes for producing a printed wiring substrate, a substrate for disposing semiconductor chips and a semiconductor device using the photosensitive resin composition.
2. Description of Related Art
As electronic instruments are recently used in portable forms, electronic instruments rapidly become lighter, thinner, shorter and smaller and have more advanced functions. Due to the above progress, semiconductor elements become smaller and more highly integrated. For example, in semiconductor circuits formed on semiconductor chips, the circuits themselves are more highly integrated, the circuits become finer due to the decrease in the size of packages and materials sealing the packages to protect chips become thinner. It is generally conducted that protecting layers such as passivation layers are used on circuits at the surface of chips to assure the reliability. To achieve further integration, circuits are formed in multi-layers with inter-layer insulation disposed between the layers.
With respect to semiconductor packages in which semiconductor chips are sealed, new packaging technologies which can achieve integration to high densities such as the ball grid array (BGA), the chip scale package (CSP) and the multi-chip module (MCM) have been developed. In these semiconductor packages, electric connection between electrodes in semiconductor chips and printed wiring boards is achieved by using interposers which are substrates constituted with various materials such as plastic and ceramics. Because the circuits formed on the substrates are introduced into the inside of semiconductors having decreased sizes, the circuits have much finer wiring and much higher degree of integration than those in conventional printed wiring circuits. Therefore, it is necessary that the fine circuits be protected by adopting the form of packaging. New technologies are developed also with respect to printed wiring boards to which these semiconductor packages are disposed. For example, in the build-up process, wiring layers are successively formed on a substrate with an insulation resin disposed between the layers to increase the density of wiring.
It is commonly required for these protecting resins and inter-layer insulation resins that the resins have high heat resistance so that the resin can withstand temperatures as high as 200 to 300° C. during bonding and disposing chips and workability in formation of holes so that electric conductivity is provided at junctions of wirings and between insulation layers. In particular, with respect to protecting films for interposers and inter-layer insulation films for circuit boards formed in accordance with the build-up process which must be worked on substrates, it is required that the resins have workability at low temperatures so that the working does not cause damage to the substrates.
Heretofore, polyimides have been used for applications which require heat resistance such as protecting films of semiconductor chips and epoxy resins have been used for applications which require working at low temperatures such as protecting films on circuit substrates and inter-layer insulation films. For pattern working such as formation of holes suitable for highly integrated circuit wiring, it is advantageous that the patterns are formed by utilizing the photomechanical process (the photographic process), i.e., by using photosensitive resins such as heat resistant photosensitive polyimide and epoxy resins.
As for the polyimide resins, photosensitive polyimides have been developed and used (for example, Japanese Patent Application Publication Showa 55(1980)-30207 and Japanese Patent Application Laid-Open No. Showa 54(1979)-145794). In general, these photosensitive polyimides form crosslinked structures by photoradical polymerization of (metha)acrylates introduced into the carboxyl group of polyamic acid which is used as the precursor of the polyimide. Pattern working such as formation of holes is conducted by utilizing the difference in solubility into developer between crosslinked area and uncrosslinked area. When the above polyamic acid is converted into a polyimide, it is necessary that the (metha)acryloyl group bonded to the carboxyl group be removed. Therefore, the ring closure for forming such an imide structure from the polyamic acid requires stronger heating than that required for the ring closure for forming conventional polyimides. Moreover, because the properties of the polyimide such as heat resistance and mechanical properties are markedly deteriorated when the removed (metha)acrylate fragment is left remaining in the polyimide, the removed (metha)acrylate fragment must be decomposed and vaporized at high temperature in order that the polyimide can exhibit the excellent characteristic properties thereof Thus, it is necessary that the photosensitive polyimides be worked at temperatures still higher than those for conventional polyimides. To overcome the problem of working at high temperatures, it has been proposed that (metha)acrylate moiety are incorporated into side chains of polyimides which has been treated by ring closure in advance so that low temperature workability is excellent (Japanese Patent Application Laid-Open No. Showa 59(1984)-108031 and the like other applications). However, the (metha)acrylate moiety are left remaining in these resins after working and the properties such as heat resistance deteriorate.
As for the epoxy resins, various types of photosensitive epoxy resins are actually used as solder resists for protection of circuit wirings and resins for inter-layer insulation for the build-up process. However, no epoxy resins exhibit satisfactory properties such as heat resistance and flexibility to follow deformation of thinner substrates contained in thinner packages.
As the photosensitive material composition advantageously used for resists exhibiting high resolution and high sensitivity, a photosensitive material composition comprising a fullerene without photosensitive groups and a photosensitive agent such as a diazide compound has been proposed (Japanese Patent No. 2814174). However, this composition has drawbacks in that the solution of the composition has low viscosity because the composition is composed of a fullerene and a low molecular weight diazide so it is difficult to coat an uniform film having a sufficient thickness. And the coating film formed by polymerization and crosslinking between the fullerene and the diazide has inferior mechanical strength and poor heat resistance. Moreover, that a fullerene which is very expensive at the present time is used in an amount five folds as much as the amount of the diazide to cause economic disadvantage.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a photosensitive resin composition of the negative type which can be applied to production of semiconductor elements and circuit wiring boards, exhibits high sensitivity and high resolution and can form resin layers having excellent heat resistance; a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device using the photosensitive resin composition; and processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device using
Shigemitsu Yasuo
Tajima Yusuke
Takeuchi Etsu
Takeuchi Kazuo
Baxter Janet
Frishauf Holtz Goodman & Chick P.C.
Lee Sin J.
Riken
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