Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-31
2006-10-31
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S678000, C257S737000, C257S781000, C438S690000, C438S759000
Reexamination Certificate
active
07129158
ABSTRACT:
A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad73is formed by providing a single tin layer74on a conductor circuit158or a via160. Therefore, a signal propagation rate can be increased, as compared with a printed wiring board of the prior art on which two metal layers are formed. In addition, due to lack of nickel layers, manufacturing cost can be decreased and electric characteristics can be enhanced.
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IBIDEN Co., Ltd.
Nelms David
Nguyen Dao H.
LandOfFree
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