Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-05-29
2007-05-29
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C029S829000, C029S830000, C438S624000
Reexamination Certificate
active
11465873
ABSTRACT:
A method of fabricating a printed wiring board comprising the following steps is provided. A portion of each of two dielectric layers or metal layers bonds to both sides of a carrier plate, respectively. Two build-up wiring structures are respectively formed on the dielectric layers or the metal layers by a build-up process. The portions of the dielectric layers or metal layers bonded to the carrier plate are removed such that the dielectric layers or metal layers and the build-up wiring structures formed thereon are released from the carrier plate to form two printed wiring boards.
REFERENCES:
patent: 2005/0150686 (2005-07-01), Powell
Cheng Shih-Lian
Ho Chung W.
Shen Leo
J.C. Patents
Subtron Technology Co. Ltd.
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