Printed circuit substrate with resistance elements

Details Printed circuit substrate with resistance elements Printed circuit substrate with resistance elements

1981-11-25

1983-01-11

Powell, William A.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

29831, 29846, 156151, 156634, 430313, 156902, 174 685, 338307, 338308, 204 15, 204 23, 427 96, 427102, B05D 512, G03C 500, C23F 102

Patent

active

043682529

ABSTRACT:
In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.

REFERENCES:
patent: 3423260 (1969-01-01), Heath et al.
patent: 3700445 (1972-10-01), Croson
patent: 3773628 (1973-11-01), Misawa et al.
patent: 3801388 (1974-04-01), Akiyama et al.

Affiliated with

Also associated with

Rating

Printed circuit substrate with resistance elements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit substrate with resistance elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit substrate with resistance elements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-778987