Printed circuit inner-layer copper foil and process for producin

Details Printed circuit inner-layer copper foil and process for producin Printed circuit inner-layer copper foil and process for producin

1994-12-20

1996-01-09

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428626, 428658, 428675, 428687, 428935, 205111, C25D 706, B32B 1520

Patent

active

054827841

ABSTRACT:
A printed circuit inner-layer copper foil having inverted tear drop-shaped fine nodules formed on both surfaces of a copper foil each having surface roughness Rz=1 to 3 .mu.m, the nodules having a length of 0.6 to 1.0 .mu.m and a maximum diameter of 0.2 to 0.8 .mu.m, and a process for producing said inner-layer copper foil.

REFERENCES:
patent: 4323632 (1982-04-01), Berdan et al.
patent: 4661417 (1987-04-01), Suzuki et al.
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5262247 (1993-11-01), Kajiwara et al.
patent: 5366814 (1994-11-01), Yamanishi et al.
patent: 5413838 (1995-05-01), Azuma et al.

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