Printed circuit dielectric foil and embedded capacitors

Details Printed circuit dielectric foil and embedded capacitors Printed circuit dielectric foil and embedded capacitors

2007-03-20

2007-03-20

Ha, Nguyen T. (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S306100, C361S306300, C361S321100, C361S311000, C361S313000

Reexamination Certificate

active

10744695

ABSTRACT:
A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (414, 664) disposed on the crystallized dielectric oxide layer, and an electrode layer (415, 665) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil (400, 600) may be adhered to a printed circuit board sub-structure (700) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (>1000 pf/mm2).

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Dong-Chun Kim and Won-Jon Lee “Effect of LANI03 Top Electrode on the Resistance . . . ” the Japan Society of Applied Physics Mar. 2002, Part 1. No. 3A pp. 1470-1476.

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