Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1988-09-02
1990-03-27
Robinson, Ellis P.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430312, 430313, 430314, 430315, 430316, 430317, 430318, 430319, 430329, 156230, 156233, 156234, 156625, 156629, 156630, 1566591, 1566611, 156901, 427 96, G03C 500
Patent
active
049120204
ABSTRACT:
A printed circuit board is described in which an electrically insulating laminate material (40) has first and second sides. An electrically conducting first circuit pattern (15) is embedded in the first side of the laminate material (40), and an electrically conducting second circuit pattern (20) is embedded in the second side of the laminate material (40) electrically insulated from the first circuit pattern (15) by the laminate material (40). A solid interconnection member (20) extends through the laminate material (40) and electrically contacts both the first and second circuit patterns (15,20) at selected locations thereof.
The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15). A second board panel (30) is also fabricated, having a raised electrically conducting third circuit pattern (35) extending from another base layer (34) of conductive material. The first board panel (10) is laminated to the second board panel (30) with a laminate insulating material (40) disposed therebetween electrically insulating the first circuit pattern (15) from the third circuit pattern (35) and with the second circuit pattern (20) electrically contacting the first circuit pattern (15) at selected portions thereof. Finally, the base layers (14,34) of conductive material are removed from the laminate insulating material (40).
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Patent Cooperation Treaty (PCT) International Search Report dated 5/17/89 for International Application No. PCT/US 88/03102, which is the PCT counterpart of the subject application, U.S. Serial No. 240,852.
IBM Technical Disclosure Buletin, Vol. 11, No. 12, May 1969, (New York, U.S.), K. F. Greene: "Producing Printed Circuit Boards", pp. 1676-1677 (see the whole document).
IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, (New York, U.S.), J. G. Cutillo et al. "High Resolution Circuitization Process", pp. 3389-3390 (see the whole document).
Decker Richard W.
King David R.
Lee Mark S.
Robinson Ellis P.
Ryan P. J.
Sutcliff W. G.
Westinghouse Electric Corp.
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