Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-02-14
1995-09-12
Ledynh, Bot L.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361743, 361795, 361778, 174260, 174261, 174262, 174263, 29830, 427 96, 427 97, 257698, 257700, H05K 114, H05K 336, B05D 512
Patent
active
054502900
ABSTRACT:
The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the circuit board by providing the necessary geometry for the footprint pattern of the chip connections without the necessity of multi-level packaging using chip carriers. The circuit board includes a substrate with plated through holes, and a film of photoresist dielectric material disposed on the substrate. The dielectric material is photo patterned to form vias which are then filled with conductive material. Electrical connection pads are formed on the exposed surface of the film of dielectric material in the pattern of the chip footprint to be mounted thereon. The vias and plated through holes are arranged in groups and patterns which provide some direct connection between the pads and plated through holes, some pads wired to vias on the exposed surface of the film of dielectric material and some vias wired to plated through holes on the surface of the substrate.
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IBM Technical Disclosure Bulletin, vol. 30, No. 7, p. 135 (Dec. 1987).
Boyko Christina M.
Bucek Francis J.
Carpenter Richard W.
Markovich Voya R.
Mayo Darleen
International Business Machines - Corporation
Ledynh Bot L.
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