Printed circuit board through hole technique

Details Printed circuit board through hole technique Printed circuit board through hole technique

1989-11-13

1990-10-23

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156634, 156656, 156902, 106 20, 427 97, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

049649485

ABSTRACT:
A process of forming plated through-holes in a printed circuit board involves placing a film of fluid ink having electrically conductive properties on a side wall of the hole, curing the film to a solid and electroplating a layer of metal on the conductive ink film. The conductive ink preferably is a composition including conductive particles such as carbon and silver flakes. The ink also preferably includes a thermosetting or radiation curable binder and a thinner. The film of ink is cured before the layer of metal is electroplated thereon. The plated through-hole is protected from the etchant when the conductors are etched by placing a radiation curable putty material into the hole, curing it, and then depositing a layer of resist on top of the cured putty and a conductive sheet clad to the substrate of the circuit board.

REFERENCES:
patent: 3158503 (1964-11-01), Young
patent: 4323593 (1982-04-01), Tsunashima
patent: 4401686 (1983-08-01), Durand
patent: 4529477 (1985-07-01), Lundberg et al.
patent: 4763403 (1988-08-01), Klein et al.

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