Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-06-25
2011-12-13
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257SE23101, C257S707000, C257S723000, C361S704000, C361S760000, C438S122000, C174S254000, C174S258000
Reexamination Certificate
active
08076772
ABSTRACT:
A printed circuit board, a memory module having the same, and a fabrication method thereof. The printed circuit board includes an interconnection substrate on which electronic components are mounted and in which a plurality of signal lines are arranged. The signal lines are electrically coupled to the electronic components. A heat sink is disposed on one surface of the interconnection substrate to dissipate heat of the electronic components, and in which no signal lines are arranged. The printed circuit board includes a bending substrate coupling the interconnection substrate to the heat sink, and formed of a flexible material configured to be bent.
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Cho Jung-Chan
Choi Hyun-Seok
Hwang Hyung-Mo
Kim Yong-Hyun
Chu Chris
Samsung Electronics Co,. Ltd.
Volentine & Whitt PLLC
LandOfFree
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