Printed circuit board maximizing areas for component utilization

Wave transmission lines and networks – Plural channel systems

Patent

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Details

333238, 361410, H01P 500

Patent

active

045531110

ABSTRACT:
A multilayer printed circuit board for TTL logic components provides an approximate 100 ohm characteristic impedance between external microstrip signal lines and internal ground and voltage planes. The addition of two internal microstrip signal plane lines permits a much greater interconnectability capability and also saves a large percentage of spatial area for component mounting while still maintaining the 100 ohm impedance characteristic.

REFERENCES:
patent: 4047132 (1977-09-01), Krajewski
patent: 4434321 (1984-02-01), Betts

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