Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-05-24
2009-02-03
Gurley, Lynne A. (Department: 2811)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S623000, C438S618000, C438S612000, C438S106000, C257S757000, C257S758000, C257S759000, C257S760000, C257SE25012, C257SE25029, C257SE23178
Reexamination Certificate
active
07485569
ABSTRACT:
A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.
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Patent Abstracts of Japan for 2004153084 A published on May 27, 2004.
Patent Abstracts of Japan for 2004007006 A published on Jan. 8, 2004.
Ahn Jin Yong
Cho Suk Hyeon
Kang Myung Sam
Lee Doo Hwan
Ryu Chang Sup
Darby & Darby P.c.
Gurley Lynne A.
Im Junghwa M
Samsung Electro-Mechanics Co. Ltd.
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