Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
2000-01-19
2000-10-24
Gaffin, Jeffrey
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361783, 174254, 174255, 174260, 257679, 235492, 29830, 29832, H05K 118, H05K 346
Patent
active
061376876
ABSTRACT:
In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period at in low cost without requiring a complex manufacturing process. A conductive material is pattern-printed on a base board and the printed conductive material is hardened to form a first conductor layer. Subsequently, an insulating material is pattern-printed on the first conductor layer, and the printed insulating material is hardened to thereby form a first insulating layer. A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer, a second insulating layer, and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured.
REFERENCES:
patent: 4045636 (1977-08-01), Yoder et al.
patent: 4258096 (1981-03-01), LaMarche
patent: 4285780 (1981-08-01), Schachter
patent: 4694572 (1987-09-01), Leber et al.
patent: 4774634 (1988-09-01), Tate et al.
patent: 4915983 (1990-04-01), Lake et al.
patent: 4963697 (1990-10-01), Peterson et al.
patent: 5352926 (1994-10-01), Andrews
patent: 5405809 (1995-04-01), Nakamura et al.
patent: 5451721 (1995-09-01), Tsukada et al.
patent: 5564617 (1996-10-01), Degani et al.
patent: 5569886 (1996-10-01), Tanabe et al.
patent: 5739476 (1998-04-01), Namgung
patent: 5837992 (1998-11-01), Onozawa
patent: 5874780 (1999-02-01), Murakami
patent: 6049461 (2000-04-01), Haghiri-Tehrani et al.
patent: 6058021 (2000-05-01), Yamamoto
Fujikawa Keiji
Kazui Shinichi
Matsuoka Makoto
Sasaki Hideaki
Shirai Mitsugu
Gaffin Jeffrey
Hitachi , Ltd.
Vigushin John B.
LandOfFree
Printed circuit board, IC card, and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board, IC card, and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board, IC card, and manufacturing method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1971233