Printed circuit board having bumps and method of forming bumps

Details Printed circuit board having bumps and method of forming bumps Printed circuit board having bumps and method of forming bumps

1989-12-18

1992-06-02

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

427 98, 1566591, 174254, 174267, H01L 2100

Patent

active

051183862

ABSTRACT:
A printed circuit board having a plurality of bumps that serve for connection terminals, the bumps being formed by covering the printed circuit except portions where the bumps are to be formed, applying an electroplating onto the uncovered bump-forming portions on the printed circuit maintaining a thickness nearly equal to that of the covering, applying thereon a non-electrolytic plating and electroplating on the whole surface from the surfaces of the bump-forming portions to the surfaces of the covered portions, and removing the platings by etching from the surface except the bump portions.

REFERENCES:
patent: 4790902 (1988-12-01), Wada et al.
patent: 4878990 (1989-11-01), Dugan et al.
"The Multilayer Printed Circuit Board Handbook", ed. by J. A. Scarlett, pp. 111-115; 450-453; .COPYRGT.1985.
"Handbook of Printed Circuit Manufacturing", by Raymond H. Clarke, pp. 5-6, .COPYRGT.1985.

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