Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-07-24
1999-04-06
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257693, 257664, 257662, H01L 2348, H01L 3900, H01L 2940
Patent
active
058922741
ABSTRACT:
The invention is to a combination of a semiconductor device and a ground plane on a printed wiring board to provide a controlled impedance signal lead. A printed wiring board has a ground plane layer, and a semiconductor device having a down-set, or deep down-set, lead frame die mounting pad is mounted on the printed wiring board above the ground plane layer. The leads of the semiconductor device form a transmission line in combination with the ground plane, when the leads are placed a controlled distance above the ground plane.
REFERENCES:
patent: 5639989 (1997-06-01), Higgins, III
Brady III Wade James
Clark Jhihan B.
Donaldson Richard L.
Saadat Mahshid
Stewart Alan K.
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